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jay
Joined: 08 Jul 2006
Posts: 22
Location: Vermont, USA
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Posted: 08 July 2006, 21:06 PM Post subject: ZX44 TQFP ATmega32 |
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I'm thinking about using the TQFP package in a board. I've used ExpressPCB to build boards for BasicX-01 (40-pin dip), but like the TQFP package. The Atmel spec for the ATmega32 specifies "Bottom pad should be soldered to ground" on the Pin Configuration sheet. Has anyone used the TQFP package? If so did you solder the bottom pad?
Thanks.. Jay |
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dkinzer
Site Admin
Joined: 03 Sep 2005
Posts: 2499
Location: Portland, OR
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Posted: 08 July 2006, 21:58 PM Post subject: |
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| The TQFP package has no bottom pad. The MLF package does, however. The ZX-24 uses the TQFP package and it has traces below the chip. You can't do that with an MLF package because of the bottom pad. |
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jay
Joined: 08 Jul 2006
Posts: 22
Location: Vermont, USA
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Posted: 08 July 2006, 23:46 PM Post subject: |
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Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay |
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DH*
Guest
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Posted: 09 July 2006, 0:09 AM Post subject: |
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| jay wrote: | Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay |
Look at Packaging Information starting on p331 of the datasheet. MLF pretty much requires a reflow (cum toaster) oven. |
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